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ESSAY ·The Investment Layer

How the AI buildout is financed

Six pools of capital finance the AI infrastructure buildout: hyperscaler cash flow, REITs, OEM balance sheets, structured debt, sovereign, and PE. Part I of The Investment Layer.

10 August 2026 · 23 min read
ESSAY ·AI Power Chain

The Services Inversion

An installed base generates maintenance work whether or not the manufacturer does it. Two conditions decide who captures the annuity: the customer's capability gap, and defensibility against independents. Seven positions across the AI infrastructure chain.

6 August 2026 · 34 min read
ESSAY ·AI Power Chain

Pricing Under Scarcity

Shortage is not the same as pricing power. Ten commercial positions across the AI infrastructure chain, sorted by the two conditions that determine whether scarcity converts to margin: how expensive escape is for the buyer, and whether qualified rivals decline to undercut.

5 August 2026 · 43 min read
ESSAY ·AI Power Chain

The AI Power Chain: Vendor Screen

vendors across 6 stacks. Capacitors, wide-bandgap, thermal, interconnect, on-package delivery, modular DC. With a weighted diligence rank you can re-weight live. Filter by geography, size, public/private. Download as CSV.

4 August 2026 · 82 min read
ESSAY

The Modular Datacenter Stack Technical Companion

Skid architectures, BESS integration, MV switchgear, busway and rack topologies for the modular hyperscale datacenter build.

2 August 2026 · 16 min read
ESSAY

The Modular Datacenter Stack: How the Building Gets Built (When There Aren't Enough Electricians)

How the AI datacenter building gets built: modular skids, BESS, UPS, busway, rack enclosures. Where PE has deployed and where returns compress.

2 August 2026 · 31 min read
ESSAY

The On-Package Delivery Stack: Technical Companion

IVR magnetics, thin-film substrates, high-density capacitors and the qualification-gated architecture of on-package power delivery.

2 August 2026 · 19 min read
ESSAY

The On-Package Delivery Stack: How 48V Becomes 0.8V at 2,250 Amperes

How 48V becomes 0.8V at the chip die: multi-phase POL, IVR, on-package power delivery, and why the foundries hold the strategic value pool.

2 August 2026 · 37 min read
ESSAY

The Interconnect Stack: Technical Companion

Where the market essay named the vendors and quantified the lead times, this piece explains the physics. Why voltage steps up, how a 400-tonne transformer moves 300 MW at 99% efficiency, why SF6 became standard and why it is being phased out.

1 August 2026 · 34 min read
ESSAY

The Interconnect Stack: Transformers, Switchgear and the Grid Equipment That Gates the AI Buildout

Grid interconnect is the binding constraint on AI. Transformer lead times doubled since 2023. Hyperscalers now build own generation to escape 4-7 year utility queues.

1 August 2026 · 46 min read
ESSAY

The Capacitor Stack: Technical Companion

Where the market essay named the vendors, this piece explains the physics. What a farad actually is, why HSCs beat batteries on 10-second pulses, why MLCCs derate under DC bias, and why a fifty-cent film cap decides whether an 800VDC rack survives its own noise.

1 August 2026 · 35 min read
ESSAY

The Thermal Stack: Technical Companion

Where the market essay named the vendors, this piece explains the physics. What 1,000 W/cm2 at the die actually means, how a hundred-dollar coupling either saves or destroys a rack, and where cooling is going next.

1 August 2026 · 41 min read
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Written by Adi Kumar · Privacy