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ESSAY ·AI infrastructure

What Ferric is worth after ADI paid $1.5 billion for Empower

ADI closed the Empower acquisition for $1.5B on July 7, 2026. Ferric is the standalone integrated voltage regulator play left. Canonical map of the last stage of AI accelerator power delivery: physics, architecture, players, scenarios, and falsifiers.

3 September 2026 · 40 min read
ESSAY

The AI Semiconductor Waterfall: $34M of Silicon Per MW of Compute

Semiconductor intensity per MW of AI compute, decomposed across compute, storage, networking, and power layers. Reference case: 1 MW Blackwell/GB200 NVL72 ≈ $34M of semiconductor-bearing equipment value. Vendor exposure map by basket.

3 September 2026 · 50 min read
ESSAY ·Grid-to-Chip

Copper hits the wall in AI racks: the migration to optical, CPO and silicon photonics

Copper loses metres each generation as per-link bandwidth scales from 400G to 1.6T. Silicon photonics fabs (GF Fotonix, TSMC), CPO specialists (Ayar Labs, Lightmatter, Ranovus, Celestial AI) and pluggable optical OEMs capture the migrating value.

2 September 2026 · 39 min read
ESSAY ·Grid-to-Chip

Battery role migration: from backup to grid-forming

The AI-DC battery is migrating through six economic roles (backup, ride-through, power smoothing, peak management, grid services, grid-forming). Each role carries a different vendor cohort, revenue mechanism and regulatory gate. Screen for role-stage exposure before chemistry.

1 September 2026 · 32 min read
ESSAY ·Financing

The Capital Stack of AI Infrastructure

Bottom-up build of the five-layer, five-source capital stack financing AI infrastructure 2026-28. Three headline measurements ($0.65T financing · $0.95T formation+procurement · $0.16T refi) plus the framework for a quarterly Ledger.

1 September 2026 · 78 min read
ESSAY

Wide-Bandgap Semis in 2026: NVTS, Wolfspeed, Innoscience, and the Contest for Sockets Above 400V

Wide-bandgap power semiconductors compete across three end markets with different physics: AI power supply, EV traction inverter, and industrial. Primary spotlight on Navitas (NVTS), Wolfspeed (post-Chapter-11), Innoscience (Nvidia Rubin Ultra 800V design win), and EPC. Extended field: Infineon, ST

1 September 2026 · 64 min read
ESSAY ·Grid-to-Chip

Mount Diablo: The Open Rack Architecture That Forced NVIDIA Up the Stack

Meta's OCP Mount Diablo spec commoditises the AI rack integration layer. Nvidia Kyber holds it proprietary. The contest allocates rack-integration margin across four vendor content planes.

31 August 2026 · 34 min read
ESSAY ·Due Diligence for the AI Buildout

The DD Evidence Matrix

31 August 2026 · 11 min read
ESSAY ·Due Diligence for the AI Buildout

Post-close validation and the DD improvement loop

The final workstream. 100-day validation testing the DD thesis against operating reality. Six-month retrospective feeding the next transaction's scoping.

30 August 2026 · 28 min read
ESSAY ·Financing

Financing structure, covenants, closing risk

How the deal gets paid for, what covenants the financing carries, and what stops closing after signing. Debt sizing, MAC clauses, and refinance stress.

30 August 2026 · 30 min read
ESSAY ·Due Diligence for the AI Buildout

Regulatory, FDI, environmental, cyber DD

CIM decks describe AI-DC targets by MW nameplate and rack counts. Diligence lawyers find the deal-killers in the workstreams CIMs skip: regulatory approval risk, FDI screening exposure, environmental legacy liability, cyber posture at Day 1 integration.

30 August 2026 · 37 min read
ESSAY ·Grid-to-Chip

How firm AI load becomes a flexible grid asset

An investment framework for the reclassification premium between firm AI capacity and firm-plus-flexible AI capacity. Five control models, three monetisation channels, and how time-to-power NPV can outweigh grid-services revenue in queue-constrained regions.

30 August 2026 · 50 min read
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Written by Adi Kumar · Privacy