Normalised Alpha / Grid-to-Chip Grid-to-Chip Grid-to-Chip Hall Power: the relocation of the power-conversion boundary 29 August 2026 · 51 min read · Updated 6 Oct 2026 The hall-power stack: hall input, UPS + conditioning, UPS battery / BBU (ride-through storage), hall-level BESS, rack distribution (RPP / PDU / 800V busway), rack interface. Migrates across V1 legacy AC → V2 hybrid 800V DC sidecar → V3 row-level 800V DC → V4 native 800V DC facility. Share on LinkedIn Respond via email More on The intermediate bus battleground: IP litigation and the possible futures for 48V-to-12V 17 Oct 2026 · 28 min read Point-of-load: the hidden AI buildout winner 13 Oct 2026 · 53 min read Copper hits the wall in AI racks: the migration to optical, CPO and silicon photonics 2 Sep 2026 · 39 min read ← Previous Legal and contract DD Next → The Lithium UPS Transition: chemistry, supply chain and vendor economics Continue reading The AI Power Chain essays + companions · the physical infrastructure of AI compute The Investment Layer essays · how the AI buildout is financed Due Diligence for the AI Buildout essays + supplements · how to run DD for AI infrastructure and industrial technology deals
The intermediate bus battleground: IP litigation and the possible futures for 48V-to-12V 17 Oct 2026 · 28 min read
Copper hits the wall in AI racks: the migration to optical, CPO and silicon photonics 2 Sep 2026 · 39 min read