The Modular Datacenter Stack Technical Companion
Skid architectures, BESS integration, MV switchgear, busway and rack topologies for the modular hyperscale datacenter build.
Technical
The On-Package Delivery Stack: Technical Companion
IVR magnetics, thin-film substrates, high-density capacitors and the qualification-gated architecture of on-package power delivery.
The Interconnect Stack: Technical Companion
Where the market essay named the vendors and quantified the lead times, this piece explains the physics. Why voltage steps up, how a 400-tonne transformer moves 300 MW at 99% efficiency, why SF6 became standard and why it is being phased out.
The Capacitor Stack: Technical Companion
Where the market essay named the vendors, this piece explains the physics. What a farad actually is, why HSCs beat batteries on 10-second pulses, why MLCCs derate under DC bias, and why a fifty-cent film cap decides whether an 800VDC rack survives its own noise.
The Thermal Stack: Technical Companion
Where the market essay named the vendors, this piece explains the physics. What 1,000 W/cm2 at the die actually means, how a hundred-dollar coupling either saves or destroys a rack, and where cooling is going next.
The Wide-Bandgap Stack: Technical Companion
Where the market essay named the players, this piece explains the physics. What wide bandgap actually means, why SiC and GaN outperform silicon at the same voltage, and how a boule of vapour-grown crystal becomes a switch that runs at 800V and 200kHz. Cross-sections, process flows, roadmaps.