The AI infrastructure M&A map
Every material deal 2023-2026 across the six layers of AI infrastructure, four through-lines that describe them, and fifteen forward candidates by name. Part II of The Investment Layer.
Every material deal 2023-2026 across the six layers of AI infrastructure, four through-lines that describe them, and fifteen forward candidates by name. Part II of The Investment Layer.
Six pools of capital finance the AI infrastructure buildout: hyperscaler cash flow, REITs, OEM balance sheets, structured debt, sovereign, and PE. Part I of The Investment Layer.
The 800VDC transition has quietly turned four sleepy component categories — HSCs, EDLCs, MLCCs, and silicon capacitors — into some of the most supply-constrained, contested layers of the AI buildout. A layer-by-layer analysis.
The DC transition isn’t one decision. It’s a stack of six. Most operators making AI infrastructure decisions in 2026 are getting one thing wrong — they’re treating it as monolithic.
The trade press writes about "the move to 800 VDC" as if it's one thing. It isn't. There are at least two competing architectures wearing that label — and they don't look much alike.
The DC transition isn't one thing and it isn't just about capacity. Four forces are pushing hyperscalers toward DC power architecture: density economics, grid constraints, GPU synchronicity, and hyperscaler strategy.